Continuous Direct Plating Line (CDP) |
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Good plating distribution |
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Stabilize plating quality |
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High performance pulse rectifier |
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Insolubility anode |
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Anti-Acid and alkali transport bells |
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Semi-auto loading device (Suitable 0.08mm ~6mm thick panel) |
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Aspects ratio reach 1:16 or higher, hole copper plating distribution has 89% higher, surface plating distribution has 5% or low |
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Suitable thinness panel |
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Fully automatic load/unload system |
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Copper strip system |
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Reduce waste gas, environment protection |
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Reduce waste gas, environment protection |
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Save energy, water and reduce running costs |
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Easy operate, maintenances and repairs |
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Less space |
