Automatic Copper Tin Process Plating Line

Automatic Immersion Ni, Au Process Line

Automatic Panel Copper Process Plating Line

 Continuous Direct Plating Line (CDP)

DMS

Production Line Testing Report

Other

Automatic Copper Tin Process Plating Line

Provide ground base or ceiling mount frame
Machine enclosure with slide doors
Fully automatic from PLC and Data monitoring system (DMS)
Flexible design productive based from customer requirement
Flexible design size of the production line
Suitable Panel thickness form 0.08mm – 6.0mm
COV≦10%
Provide long-clip, short-clip and basket for thin size of panel plating mode
Flexible cycle time adjustable
Individual agitation mode
High performance air blower and educator
High applicable aspects radio
User –friendly interface
Provide single arms or frame style transporters

 
 
 

 

 

 

 

 

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